Norris-Landzberg-Exponential Model

Validate calculation of Norris-Landzberg relationship (can be done using the GLL model in ALTA with proper transformation for each stress).

Data is from Example 7.2 on page 257 in book Life Cycle Reliability Engineering by Dr. Guangbin Yang, John Wiley & Sons, 2007.

The thermal cycling profiles and test results for chip-scale package solder joints are given below. A thermal cycling profile can be represented by 3 independent stresses in Norris-Landzberg relationship. They are the maximum temperature, the temperature difference , and cycling frequency.

For this data set, a multiple linear regression model is used in the book. The model parameters are estimated using the least squared estimation. The regression model is

In ALTA, the General Log-linear model is used with the proper transformation for each stress. The failure time distribution is Exponential.