Generalized Eyring Example - Revision history

Lisa Hacker at 19:03, 18 September 2023

2023-09-18T19:03:18Z

← Older revision		Revision as of 19:03, 18 September 2023
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	<noinclude>{{Banner_ALTA_Examples}}		<noinclude>{{Banner_ALTA_Examples}}
	''This example appears in the [~~[Eyring_Relationship#Generalized_Eyring_Relationship\|~~Accelerated ~~Life Testing Data Analysis Reference~~]~~] book~~.''		''This example appears in the [https://help.reliasoft.com/reference/accelerated_life_testing_data_analysis Accelerated life testing reference].''

	</noinclude>		</noinclude>

Nicolette Young at 15:19, 17 December 2015

2015-12-17T15:19:45Z

← Older revision		Revision as of 15:19, 17 December 2015
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	The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10\,\!</math> life at the use conditions of <math>T=350K\,\!</math> and <math>H=0.3\,\!</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.		The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10\,\!</math> life at the use conditions of <math>T=350K\,\!</math> and <math>H=0.3\,\!</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.

	[[Image:406-1-2.png\|center\|~~650px~~\|]]		[[Image:406-1-2.png\|center\|800px\|]]

	The probability plot at the use conditions is shown next.		The probability plot at the use conditions is shown next.

Richard House at 22:14, 21 September 2012

2012-09-21T22:14:46Z

← Older revision		Revision as of 22:14, 21 September 2012
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	</noinclude>		</noinclude>
	The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10\,\!</math> life at the use conditions of <math>T=350K\,\!</math> and <math>H=0.3\,\!</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.		The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10\,\!</math> life at the use conditions of <math>T=350K\,\!</math> and <math>H=0.3\,\!</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.

	[[Image:406-1-2.png\|center\|650px\|]]		[[Image:406-1-2.png\|center\|650px\|]]
	~~<math></math>~~

	The probability plot at the use conditions is shown next.		The probability plot at the use conditions is shown next.
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	[[Image:plotfolio426.png\|center\|550px\|]]		[[Image:plotfolio426.png\|center\|550px\|]]

	The <math>B10\,\!</math> information is estimated to be 1967.2 hours, as shown next.		The <math>B10\,\!</math> information is estimated to be 1967.2 hours, as shown next.

	[[Image:tempBX.png\|center\|550px\|]]		[[Image:tempBX.png\|center\|550px\|]]

Richard House at 23:52, 22 August 2012

2012-08-22T23:52:13Z

← Older revision		Revision as of 23:52, 22 August 2012
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	</noinclude>		</noinclude>
	The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10</math> life at the use conditions of <math>T=350K</math> and <math>H=0.3</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.		The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10\,\!</math> life at the use conditions of <math>T=350K\,\!</math> and <math>H=0.3\,\!</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.

	[[Image:406-1-2.png\|center\|650px\|]]		[[Image:406-1-2.png\|center\|650px\|]]
Line 12:		Line 12:
	[[Image:plotfolio426.png\|center\|550px\|]]		[[Image:plotfolio426.png\|center\|550px\|]]

	The <math>B10</math> information is estimated to be 1967.2 hours, as shown next.		The <math>B10\,\!</math> information is estimated to be 1967.2 hours, as shown next.

	[[Image:tempBX.png\|center\|550px\|]]		[[Image:tempBX.png\|center\|550px\|]]

Kate Racaza: added link to ALTA book

2012-08-14T01:36:13Z

added link to ALTA book

← Older revision		Revision as of 01:36, 14 August 2012
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	<noinclude>{{Banner_ALTA_Examples}}		<noinclude>{{Banner_ALTA_Examples}}
	</noinclude>The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10</math> life at the use conditions of <math>T=350K</math> and <math>H=0.3</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.		''This example appears in the [[Eyring_Relationship#Generalized_Eyring_Relationship\|Accelerated Life Testing Data Analysis Reference]] book.''

			</noinclude>
			The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10</math> life at the use conditions of <math>T=350K</math> and <math>H=0.3</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.

	[[Image:406-1-2.png\|center\|650px\|]]		[[Image:406-1-2.png\|center\|650px\|]]

Richard House at 07:40, 7 August 2012

2012-08-07T07:40:41Z

← Older revision		Revision as of 07:40, 7 August 2012
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	<noinclude>{{Banner_ALTA_Examples}}		<noinclude>{{Banner_ALTA_Examples}}
	</noinclude>The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10</math> life at the use conditions of <math>T=350K</math> and <math>H=0.3</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.		</noinclude>The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10</math> life at the use conditions of <math>T=350K</math> and <math>H=0.3</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.
	~~<br>~~

			[[Image:406-1-2.png\|center\|650px\|]]
	[[Image:406-1-2.png\|center\|~~550px~~\|]]
	<math></math>		<math></math>

	The probability plot at the use conditions is shown next.		The probability plot at the use conditions is shown next.

	~~<br>~~
	[[Image:plotfolio426.png\|center\|550px\|]]		[[Image:plotfolio426.png\|center\|550px\|]]
	~~<br>~~

	The <math>B10</math> information is estimated to be 1967.2 hours, as shown next.		The <math>B10</math> information is estimated to be 1967.2 hours, as shown next.
	~~<br>~~
	[[Image:tempBX.png\|center\|550px\|]]		[[Image:tempBX.png\|center\|550px\|]]

Kate Racaza: updated banner

2012-08-02T01:57:56Z

updated banner

← Older revision		Revision as of 01:57, 2 August 2012
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	{~~\| class="FCK__ShowTableBorders" border="0" cellspacing="0" cellpadding="0" align="center"; style="width:100%;"~~		<noinclude>{{Banner_ALTA_Examples}}
	\|-		</noinclude>The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10</math> life at the use conditions of <math>T=350K</math> and <math>H=0.3</math>. The data set is modeled using the lognormal distribution and the generalized Eyring model.
	~~\| valign="middle" align="left" bgcolor=EEEDF7\|[[Image: ALTA_Examples_Banner.png\|400px\|center]]~~
	\|}
	<br>
	The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10</math> life at the use conditions of <math>T=350K</math> and <math>H=0.3</math> . The data set is modeled using the lognormal distribution and the generalized Eyring model.
	<br>		<br>


	[[Image:406-1-2.png~~\|thumb~~\|center\|~~400px~~\|]]		[[Image:406-1-2.png\|center\|550px\|]]
	<math></math>		<math></math>

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	<br>		<br>
	[[Image:plotfolio426.png~~\|thumb~~\|center\|~~400px~~\|]]		[[Image:plotfolio426.png\|center\|550px\|]]
	<br>		<br>

	The <math>B10</math> information is estimated to be 1967.2 hours, as shown next.		The <math>B10</math> information is estimated to be 1967.2 hours, as shown next.
	<br>		<br>
	[[Image:tempBX.png~~\|thumb~~\|center\|~~400px~~\|]]		[[Image:tempBX.png\|center\|550px\|]]

	~~<br>~~

Chris Kahn at 10:04, 27 July 2012

2012-07-27T10:04:48Z

← Older revision		Revision as of 10:04, 27 July 2012
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	{\| class="FCK__ShowTableBorders" border="0" cellspacing="0" cellpadding="0" align="center"; style="width:100%;"		{\| class="FCK__ShowTableBorders" border="0" cellspacing="0" cellpadding="0" align="center"; style="width:100%;"
	\|-		\|-
	\| valign="middle" align="left" bgcolor=EEEDF7\|[[Image: ~~ALTA-Examples-banner~~.png\|400px\|center]]		\| valign="middle" align="left" bgcolor=EEEDF7\|[[Image: ALTA_Examples_Banner.png\|400px\|center]]
	\|}		\|}
	<br>		<br>

Nikki Helms: Created page with '{| class="FCK__ShowTableBorders" border="0" cellspacing="0" cellpadding="0" align="center"; style="width:100%;" |- | valign="middle" align="left" bgcolor=EEEDF7|[[Image: ALTA-Exa…'

2012-03-21T22:14:09Z

Created page with '{| class="FCK__ShowTableBorders" border="0" cellspacing="0" cellpadding="0" align="center"; style="width:100%;" |- | valign="middle" align="left" bgcolor=EEEDF7|[[Image: ALTA-Exa…'

New page

{| class="FCK__ShowTableBorders" border="0" cellspacing="0" cellpadding="0" align="center"; style="width:100%;"
|-
| valign="middle" align="left" bgcolor=EEEDF7|[[Image: ALTA-Examples-banner.png|400px|center]]
|}
 
The following data set represents failure times (in hours) obtained from an electronics epoxy packaging accelerated life test performed to understand the synergy between temperature and humidity and estimate the <math>B10</math> life at the use conditions of <math>T=350K</math> and <math>H=0.3</math> . The data set is modeled using the lognormal distribution and the generalized Eyring model.
 

[[Image:406-1-2.png|thumb|center|400px|]]
<math></math>

The probability plot at the use conditions is shown next.

 
[[Image:plotfolio426.png|thumb|center|400px|]]
 

The <math>B10</math> information is estimated to be 1967.2 hours, as shown next.
 
[[Image:tempBX.png|thumb|center|400px|]]